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STPAC01F2
IPADTM, RF detector for power amplifier control
Features
STPAC01F2 has two outputs - one for the signal detection - one for the temperature compensation VDCout = 0.88 V at 0.85 GHz at 10 dBm VDCout = 1.07 V at 1.85 GHz at 10 dBm Vsupply = 5 V max Lead-free package Figure 1. Pin layout (bump side)
3 2
V Temp
Gnd1 Gnd1 Gnd2 Bias

Flip Chip (8 bumps)
Benefit
1
The use of IPAD technology allows the RF front-end designer to save PCB area and to drastically reduce parasitic inductances.
DC out
Gnd1
A B C
Applications
Target applications are cellular phones and PDA using GSM, DCS, PCS, AMPS, TDMA, CDMA and 800 MHz to 1900 MHz frequency ranges. Figure 2.
RFin
Functional diagram
Coupler VBIAS RF input RF detector Low pass filter Thermal compensation STPAC01F2 GND1 GND2
Description
The STPAC01F2 is an integrated RF detector for the power control stage. It converts RF signal coming from the coupler into a DC signal usable by the digital stage. It is based on the use of two similar diodes, one providing the signal detection while the second one is used to provide temperature information to a thermal compensation stage. A biasing stage suppresses the detection diode drop voltage effect.
VDCOut Vtemp
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 2
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www.st.com 7
Characteristics
STPAC01F2
1
Characteristics
Table 1.
Symbol VBIAS PRF FOP VPP TOP TSTG Bias voltage RF power at the RF input Operating frequency range ESD level as per MIL-STD 883E method 3015.7 notice 8 (HBM) Operating temperature range Storage temperature range
Absolute ratings (Tamb = 25 C)
Parameter Value 5 20 0.8 to 2 250 - 30 to + 85 - 55 to + 150 Unit V dBm GHz V C C
Table 2.
Symbol VBIAS IBIAS
Parameters related to bias voltage
Parameter Operating bias voltage Bias current VBIAS = 3.2 V Test conditions Min. 2.2 Typ. Max. 3.2 0.5 Unit V mA
Table 3.
Symbol
Parameters related to detection function (VBIAS + 2.7 V, DC output load = 100 k)
Parameter Test conditions F = 1.85 GHz, PRF = 10 dBm Min. 0.97 1.83 0.78 1.83 Typ. 1.07 1.93 0.88 1.93 0.09 V
0.44
Max. 1.17 2.03
Unit
VDCout
DC output voltage (see Figure 1, IDC = 50 A)
F = 1.85 GHz, PRF = - 20 dBm F = 0.85 GHz, PRF = 10 dBm F = 0.85 GHz, PRF = - 20 dBm
V 0.98 2.03
VDCout
0 < Tamb < 70 C DC output voltage F = 1.85 GHz, PRF = 10 dBm variation (see Figure 7, 2.2 < VBIAS < 3.2 V IDC = 50 A) F = 1.85 GHz, PRF = 10 dBm
Table 4.
Symbol VTemp VTemp
Parameters related detection function
Parameter Temperature output voltage (see Figure 8) Temperature output voltage variation (see Figure 8) Test conditions IDC = 50 A IDC = 50 A, 0 < Tamb < 70 C IDC = 50 A, 2.2 < VBIAS < 3.2V Min. 1.83 Typ. 1.93 0.09 V 0.44 Max. 2.03 Unit V
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STPAC01F2
Characteristics
Figure 3.
VDCout measurement circuit
RF in STPAC test board VDCOut
Figure 4.
VDCout 2
VDCout versus RF input power
RF generator
Multimeter
1.8 1.6 1.4 1.2 Tamb = 25C Ibias = 50A Vbias = 2.7V
Power supply
VBIAS
DC output voltage
1850MHz 850MHz
Current generator
IDC
1 0.8 -20
-15
-10
-5 Pin (dBm)
0
5
10
Figure 5.
Relative variation of VDCout versus frequency (from 800 to 900 MHz)
Figure 6.
Relative variation of VDCout versus frequency (from 1800 to 1900 MHz)
VDCout (Freq.) / VDCOut (850MHz) 1.05 1.05
VDCout (Freq.) / VDCOut (850MHz)
1
1
0.95
0.95
0.9 800
825
850 Frequency in MHz
875
900
0.9 1800
1825
1850 Frequency in MHz
1875
1900
Figure 7.
Temperature effect measurement circuit on VDCout
Climatic chamber
Figure 8.
Vtemp measurement circuit
Climatic chamber
RF generator
RF in
STPAC test board
VDCOut Multimeter DC output voltage Power supply VBIAS
STPAC test board
Vtemp Multimeter Temp. voltage
Power supply
VBIAS
Current generator
IDC
Current generator
IDC
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Application information Figure 9. Vtemp output voltage versus ambient temperature
Vtemp 1.98 Ibias = 50A 1.96 1.94 1.92 1.9 1.88 0 10 20 30 40 50 60 70 Tamb (C)
STPAC01F2
2
Application information
Figure 10. Application diagram
Coupler VBIAS RF input RF detector Low pass filter Thermal compensation STPAC01F2 IDC = 50A GND1 GND2 IDC = 50A
VDCOut Vtemp
+
Out
The STPAC01 is the first part of the power amplifier stage and provides both RF power and die temperature measurements. Figure 10 shows the basic circuit of RF detector. A coupler located on the line between RF amplifier output and the antenna takes a part of the available power and applies it to STPAC01 RF input. The RF detector and the low-pass filter provide a DC voltage depending on the input power. Thermal compensation provides a DC voltage depending on the ambient temperature. As the detection system and the thermal compensation are based on the same topology, VDCout will have the same temperature variation as Vtemp. Connected to a differential amplifier, the output will be a voltage directly linked to the RF input power. VDCout and Vtemp must be biased with 50 A DC current. This topology offers the most accurate output value as it is 100% compensated.
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STPAC01F2
Package information
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Flip Chip dimensions
500 m 50 650 m 65 315 m 50
500 m 50
1.57 mm 50 m
Figure 12. Footprint
Copper pad Diameter: 250 m recommended, 300 m max
Figure 13. Marking
Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
285 m
285 m
1.57 mm 50 m
E
Solder stencil opening: 330 m
Solder mask opening recommendation: 340 m min for 300 m copper pad diameter
xxz y ww
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Ordering information Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location 4 0.1 O 1.5 0.1
STPAC01F2
1.75 0.1 3.5 0.1
1.68
0.73 0.05
All dimensions in mm
8 0.3
STE
STE
STE
xxz yww
User direction of unreeling
xxz yww
xxz yww
4 0.1
1.68
Note:
More informations are available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements"
4
Ordering information
Table 5. Ordering information
Marking RA Package Flip Chip Weight 3.3 mg Base qty 5000 Delivery mode Tape and reel 7"
Order code STPAC01F2
5
Revision history
Table 6.
Date 21-Oct-2004 29-Apr-2008
Document revision history
Revision 1 2 Initial release. Updated ECOPACK statement. Updated Figure 11, Figure 12, Figure 13 and Figure 14. Reformatted to current standards. Changes
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STPAC01F2
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